Warpage of QFN Package in Post Mold Cure Process of integrated circuit packaging
نویسندگان
چکیده
منابع مشابه
Investigation of Warpage Induced on Molded Strip of Qfn Package
Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects the package sawing process, and cause reliability issues. The main cause of warpage of area array packages is the coefficient thermal expansion (CTE) mismatch between the moulding compound and other components inside the package. The objective of this study is to investigate the warpage induced o...
متن کاملEffect of Molding Compound and Die Attach Adhesive Material on Qfn Package Delamination and Warpage Issues
The presence of thermal mismatch between different materials of plastic IC packages was found to cause reliability and moldability issues such as delamination and warpage phenomenon. Delamination and warpage between the mold compound and die attach adhesive material were evaluated for Quad Flat No-lead (QFN) package. Evaluation was conducted on two set of different materials combination of epox...
متن کاملThe Reliability Challenges of Qfn Packaging
The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common dri...
متن کاملTHE EFFECT OF DELAMINATION BETWEEN MOLD COMPOUND AND Ni/Pd/Au LEADFRAME ON QFN PACKAGE
The susceptibility of QFN package to delamination, particularly in the area between the Ni/Pd/Au leadframe die pad and mold compound, has been a major concern to many IC manufacturers. The presence of a Ni/Pd/Au oxide layer on the leadframe of QFN packages was found to cause delamination at the die pad or mold compound interface. Delamination refers to the disbonding between a surface of the mo...
متن کاملWarpage and Wire Sweep Analysis of Qfn Molded Array Strip Using Modeling and Experimental Methods
In this paper, both experimental and modeling works were resorted to analyze the warpage and wire sweep of QFN molded strip. The effect of QFN package size was investigated to provide the relation between warpage and metal to mold compound ratio. Design guideline for optimum metal to mold compound ratio has been obtained. Nonlinear large deformation of finite element analysis has been performed...
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ژورنال
عنوان ژورنال: Journal of Physics: Conference Series
سال: 2017
ISSN: 1742-6588,1742-6596
DOI: 10.1088/1742-6596/901/1/012089